Adhesion & Bonding Expo 2025 Osaka

Adhesion & Bonding Expo is the leading industrial adhesion expo that gathers joining equipment and bonding technologies from materials to welding, friction stirring, ultrasonic, diffusion, and more. It also attracts attentions for dissimilar material joining technologies. Held twice a year in Osaka and Tokyo, attendees can explore a wide variety of adhesive agent, test out industrial equipment, and learn from industry experts throughout the technical conference sessions.​

Adhesion & Bonding Expo

14 - 16 May 2025

INTEX Osaka, Japan